The NS63103A uses Chip Scale Packaging(CSP) techniques to achieve the industry advanced 1.8 x 1.4 mm footprint.
The duplexer exhibits excellent power handling capabilities.
Duplexer
B3
SAW
CSP 1.8 x 1.4 mm
2.4/2.5
單端
量產(chǎn)
5000
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